3/20/2024 0 Comments Reflow profile for leaded solder(Recommended: automatically stir 3 ± 0.5 minutes, hand-mixing 5 ± 1 minute, mixer speed: revolution 400rpm, rotation 100rpm).ģ. Do not use the leftover paste paste mixed with the new packaging in the same bottle. This product meets the requirements of the RoHS(Restriction of Hazardous Substances) Directive,2002/95/EC Article 4 for the stated banned substance.ġ. Open the package using the solder paste is necessary before fully warmed to room temperature (recommended for 4 hours) return temperature for 48 hours in the retention period, after opening a period of 12 hours, stay in the solder paste reflow PCB board to have pre- idle time is 100 ± 20 minutes.Ģ. Cold storage may cause the separation of components within the solder paste, solder paste is stirred well before use 3 to 5 minutes to re-mix. LF-05 Sn42Bi58 Solder Paste RoHS Compliance Photos of Sn42-Bi58 LF-05 no clean bi solder paste Shelf life is general 6months from date of manufacture and held at 3-8☌ R520A should be kept at standard refrigeration temperatures, 3-8☌ Please contact BBIEN if you require additional advice with regard to storage and handling of this material. Reflow characteristics, and overall performance.Sn42-Bi58 stencil and dispensing solder paste/cream should be stabilized at room temperature prior to printing. Keep solder paste into refrigeration is the recommended optimum storage condition for solder paste to maintain consistent viscosity, Sn42Bi58can also be cleaned using commercially available flux residue removers such as cleaning flux ,which is available from BBIEN. Each jar/bottle holds the solder paste is 500g,50g Each cartridge can load the solder paste is 100g The packing materials can be separated into inner layer of a bubble box and outer package of a paper carton so as to better secure for shipping and transportation.Ĭustomized logo:can be available when MOQ above 500kgīBIEN LF-05 low temperature tin bi solder paste Sn42Bi58 is no clean type of soldering paste, belongs to environmental friendly solder materials. Packing could be classified as can/bottle packing and syringe packing type. Microprint's small particle size of 5-45µm (-450+600 mesh), guarantees repeatable print definition to below 0.3mm for ♛ga work Pakistan,UAE,South Korea,America,Mid-east countries,Brazial,India,Iran,Egype,Turkey The Sn42Bi58 Bi series is designed to meet requirements for reliable solder joints in SMT PC board assemblies, this lead free no clean Bi solder paste can also apply for household-electrical products,which including hand-held electronic devices such as smart phones and tablets, computer motherboards, consumer electronic products, network servers, automotive systems, medical and military equipment and many others. The flux residue from LF-05 Sn42Bi58 is clear, colorless, and provides excellent electrical resistivity, exceeding industry standards and get good reflowing soldering process result.Įnergy-saving by reducing the required reflow profile temperature, electricity consumption can be reduced by approximately 40% compared to SAC305.Reduction of electricity consumption results in reduction in CO2 emissions, achieving both energy saving and environmental care. The lead-free alloy in LF-05 Sn42Bi58 has a melting point 138☌, and has been successfully used with peak reflow profiles between 155☌ and 190☌. LF-05 Sn42Bi58 Pb-free tin bismuth solder paste is designed to enable low temperature surface mount assembly technology. High peak temperature can cause the damage of the component, damage of the assembly or detach of the pervious soldered components.138degree melting low temperature solder paste LF-05 Sn42Bi58 Since larger components normally reach lower maximum temperatures during reflow than smaller ones, because of the different heat capacities, keeping them below their ratings may not be difficult, as long as 250 ☌ is used as the maximum temperature for the joints of smaller components. This means that 250 ☌ may not be usable as the maximum joint temperature for some components a lower temperature may be required. Although Intel BGAs are generally rated at 260 ☌, other components, especially large ones, may be rated at 250 ☌ or 245 ☌. Components are typically rated as per J-STD-020C (or later), based on their package thickness and volume. Higher T g material is not necessarily more resistant to this damage, and must be tested for compatibility. If maximum solder joint temperatures exceed 250 ☌, PCB damage such as delamination and warpage may result when standard FR4 (T g =130 ☌) material is used. 250 ☌ is recommended as the maximum temperature for all solder joints on the board, except for components with temperature ratings lower than 250 ☌.
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